Semiconductor Bonding Market Analysis, Latest Trends and Regional Growth Forecast by Types and Applications, 2022

Semiconductor Bonding Market size is projected to
reach 1064.38 million USD by 2027 from an estimated 875.98 million USD in 2021,
growing at a CAGR of 3.3% globally.

Semiconductors are made up of atoms bonded together to
form a uniform structure. Each silicon atom has four valence electrons which
are shared, forming covalent bonds with the four surrounding Si atoms. Direct
bonding, or fusion bonding, describes a wafer bonding process without any
additional intermediate layers. The bonding process is based on chemical bonds
between two surfaces of any material possible meeting numerous requirements.
These requirements are specified for the wafer surface as sufficiently clean,
flat and smooth. Otherwise unbounded areas so called voids, i.e. interface
bubbles, can occur. Wire bonding is the method of making interconnections
between an integrated circuit (IC) or other semiconductor device and its
packaging during semiconductor device fabrication. Although less common, wire
bonding can be used to connect an IC to other electronics or to connect from
one printed circuit board (PCB) to another.

IMR offers a comprehensive overview of the market
through the analysis of key parameters such as revenue, price, competition, and
promotions, as well as the study, synthesis, and summarization of data from
different sources. It analyzes the leading industry drivers and shows numerous
market components. The information offered is thorough, dependable, and the
result of a comprehensive primary and secondary study. IMR market research
reports offer a comprehensive global market as well as an in-depth strategic
sourcing methodology and analysis based on qualitative and quantitative
research to anticipate market growth.

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Players Covered In Semiconductor Bonding Market Are:

BE Semiconductor Industries

ASM Pacific Technology

Kulicke &


Fuji Corporation(Japan)

Yamaha Motor Robotics
Corporation Co.(Japan)

SUSS MicroTech SE(Germany)

Shiaura Mechatronics(Japan)

Market has segmented the global Semiconductor Bonding market on the basis of type, application, and region:


By Type:


Die Bonder

Wafer Bonder

and Flip Chip Bonder

 By Application:

RF Devices

MEMS and Sensors


Image Sensors

 By Regional Outlook
(Revenue, USD Billion, 2017 – 2028)


North America (U.S., Canada, Mexico)

Europe (Germany, U.K., France, Italy,
Russia, Spain, Rest of Europe)

Asia-Pacific (China, India, Japan,
Southeast Asia, Rest of APAC)

Middle East & Africa (GCC Countries,
South Africa, Rest of MEA)

South America (Brazil, Argentina, Rest of
South America)

Impact and Recovery Analysis on Industry:

The COVID-19 pandemic has had devastating effects on
several industry verticals globally. To constrain the number of cases and slow
the coronavirus spread, various public health guidelines were implemented in
different countries across the globe. COVID-19 protocols ranging from declaring
national emergency states, enforcing stay-at-home orders, closing nonessential
business operations and schools, banning public gatherings, imposing curfews,
distributing digital passes, and allowing police to restrict citizen movements
within a country, as well as closing international borders. With the growing
vaccination rate, governments are uplifting the protocols to give a boost to
the stagnant economy. Like other industries, Cloud Service Mesh Market have
experienced slowdown the growth, however market is expected bounce back as
restrictions are being lifted up by governments across the globe.

Semiconductor Bonding Market report covers the
detailed analysis on current and upcoming market trends, company market shares,
market projections, competitive benchmarking, competition mapping, and in-depth
research of the most significant sustainability strategies and their impact on
industry growth and competition. The research was conducted using a combination
of primary and secondary data, as well as input from leading industry players.


In October 2020, BE Semiconductor
Industries N.V. (Besi) collaborated with Applied Materials, Inc. to develop the
industry’s first complete and proven equipment solution for die-based hybrid
bonding, an emerging chip-to-chip interconnect technology that enables
heterogeneous chip and subsystem designs for applications including
high-performance computing, AI, and 5G.

(ASMPT) and EV GROUP (EVG) collaborated to create die-to-wafer hybrid bonding
solutions for 3D-IC and heterogeneous integration applications. Chiplet
technology combines chips with different process nodes into advanced packaging
systems that can power new applications such as 5G, high-performance computing
(HPC), and artificial intelligence.

Die-to-wafer hybrid bonding is a key
process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked
chips via chiplet technology—combining chips with different process nodes into
advanced packaging systems that can power new applications such as 5G, HPC, and
artificial intelligence (AI).

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